Opportunities Publication

Call for Submissions- The IP Press Law Review: Volume I Issue 2 [Submit by Jan 2]


We are pleased to inform you that the IP Press Law Review is inviting submissions for the second issue of its first volume. The last date for the entries is January 2, 2023. For further details, please refer to the call below.  

Call for Submissions: The IP Press Law Review: Volume I Issue 2 (2022)

About the Law Review:
The IP Press Law Review (IPPLR) is an initiative of The IP Press to extend our objectives of spreading awareness on the issues concerning intellectual property rights and related laws. The main aim behind starting this journal is to promote study and research in the field of intellectual property laws.

Call for Submissions:

The IP Press Law Review invites original and unpublished manuscripts including but not limited to long articles, short articles, case notes & comments, and book reviews related to the field of intellectual property and allied laws. The contributions are invited from academicians, practitioners, legal professionals, research scholars, and students.

Long Articles   6000- 8000 words [inclusive of footnotes] In-depth analysis of a contemporary legal issue.The lacunae or research gap. Suggestions & Opinions.
Short Articles 3000- 6000 words [inclusive of footnotes] Comprehensive analysis of a specific legal issue.The legal challenge and way forward.
Case Notes & Comments 1500 – 3000 words [inclusive of footnotes] Any recent case law that discusses a contemporary legal issue. It should contain a critical analysis of – obiter dicta or specific legal predicament set forth in particular case law or – policy reform proposal or – legislative development or – amendments.
Book Review 1000-1500 words [inclusive of footnotes] It should include a short summary of the book, background information about the author and topic, and an evaluation of the content.

The deadline for submission is 2nd January 2023.

For any queries, contact- theippresslawreview[at]gmail[dot]com.

Leave a Reply

Your email address will not be published. Required fields are marked *